SIPLACE TX
Faster, smaller, more advanced – the new high-end placement solution
The latest generation of our placement modules sets new records in speed, floorspace performance and accuracy for high-volume production applications. And for the first time, 0201 (metric) components can be placed at the highest speed.
SIPLACE TX highlights:
- SIPLACE SpeedStar placement head, with an accuracy rating of up to 25 µm/3 sigma
- SIPLACE MultiStar: Up to 25,500 cph
- SIPLACE TwinStar: The head for special tasks
- SIPLACE JEDEC Tray Feeder: With up to 18 JEDEC trays
- ASM Shuttle Extension: Active transport unit for easy handling of single and dual conveyors
- SIPLACE TX micron: Placement accuracy of up to 15 µm @ 3 sigma
- More flexibility and performance through the combination of SIPLACE SpeedStar and SIPLACE MultiStar heads in a single placement area
- NEW: SIPLACE SpeedStar with up to 48,000 cph and maximum component size of 8.2 mm x 8.2 mm x 4 mm
- NEW: Placement force as low as 0.5 N for sensitive components
- NEW: Touchless placement: Maximum placement quality for highly sensitive components
- NEW: SIPLACE Smart Pin Support: Automated pin support for printed circuit boards
- NEW: Maximum PCB size 550 mm x 460 mm
Related topics
SIPLACE SpeedStar
Extremely fast and with long-term precision
SIPLACE SX
Our placement solution for high-mix electronics production
SIPLACE JEDEC Tray Feeder
Flexible component supply
ASM Shuttle Extension
ASM transport extensions for reliable and smart PCB handling
SIPLACE TX micron
High speed and high accuracy for submodules and SiPs
SIPLACE Pro
Create, verify and optimize placement programs