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Oliver Kraus

Solutions Marketing Manager

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Touchless placement

ASM Assembly Systems new placement process for very sensitive components. The SIPLACE SpeedStar CP20 head can place fragile components such as dies with precision and control using a placement force of 0 N.

Related topics

SIPLACE SpeedStar

SIPLACE SpeedStar

Extremely fast and with long-term precision

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SIPLACE SX

SIPLACE SX

Our placement solution for high-mix electronics production

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Capacity-on-Demand

Capacity-on-Demand

Scale lines up or down as needed

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Good planning is the basis for efficiency, flexibility and quality in electronics production. As the industry’s technology leader, we offer a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.

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