SIPLACE CA
Chip assembly and SMT placement in a single machine
Integrate high-growth technologies of the future such as flip chips and die attach into your SMT production with the SIPLACE CA, the world’s first platform that lets you flexibly combine the placement of bare dies directly from the wafer with classic feeder-based SMT placement. Your competitive advantage: New, future-proof applications can be implemented on a single SMT line without any additional special processes. It is the ideal machine for “Advanced Packaging” applications. Another benefit: For all other jobs, the SIPLACE CA operates as a powerful “normal” SMT placement machine.
Highlights of the SIPLACE CA:
- With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour
- Component supplied from changeover tables/feeders or SIPLACE wafer systems for 4-inch to 12-inch wafers
- Attach unit and linear dipping unit
- High-precision bare-die placement for embedded wafer level ball grid array
- NEW: Accuracy of up to 10 µm @ 3 s
- NEW: Max. board size of 850 mm x 560 mm
- NEW: Only 2.0 meters long (20 percent less than before)
- NEW: Can be configured with SIPLACE MultiStar
- NEW: Minimum placement force of 0.5 N
- NEW: Linear dipping with improved usability Flux inspection by vision system
Related topics
SIPLACE SpeedStar
Extremely fast and with long-term precision
SIPLACE MultiStar
The first head that changes its mode on demand