ENABLING THE DIGITAL WORLD

Placement Heads

Fewer placement heads – more flexibility on the shop floor

Our modern SIPLACE X and SX placement machines handle the component spectrum for which other vendors require a slew of specialty heads.

Just three models:

  • SIPLACE MultiStar
    The innovation in head technology for high-mix environments. The world’s first placement head that can switch on demand between Collect & Place mode, Pick & Place mode and Mixed mode while placing up to 23,500 components per hour ranging from 01005 to 50 x 40 mm.
  • SIPLACE SpeedStar
    Our 20-nozzle Collect & Place high-speed head for placing up to 39,000 standard components (0201 (metric) to 8.2 mm x 8.2 mm) per hour.
  • SIPLACE TwinStar
    Available in special versions as High Force and Very High Force Head, the SIPLACE TwinStar can apply placement forces of up to 30 N and 100 N, respectively, for components that are up to 50mm high.

Related topics

SIPLACE SpeedStar

SIPLACE SpeedStar

Extremely fast and with long-term precision

SIPLACE TwinStar

SIPLACE TwinStar

Intelligent and forceful

SIPLACE MultiStar

SIPLACE MultiStar

The first head that changes its mode on demand

Capacity-on-Demand

Capacity-on-Demand

Scale lines up or down as needed

ASM Material Manager

ASM Material Manager

Optimize your material-related workflows

Best-in-class solutions

Good planning is the basis for efficiency, flexibility and quality in electronics production. As the industry’s technology leader, we offer a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.

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